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Aehr Test Systems Debt/Equity

What is the Debt/Equity of Aehr Test Systems?

The Debt/Equity of Aehr Test Systems is 0.15

What is the definition of Debt/Equity?



Debt to equity ratio is a financial ratio indicating the relative proportion of shareholders’ equity and debt used to finance a company’s assets.

lfy (last fiscal year)

The debt to equity ratio is generally calculated by dividing debt by equity. The D/E ratio is also known as risk, gearing or leverage. The two components are often taken from the firm's balance sheet or statement of financial position (so-called book value), but the ratio may also be calculated using market values for both, if the company's debt and equity are publicly traded, or using a combination of book value for debt and market value for equity financially. Preferred stock can be considered part of debt or equity. Attributing preferred shares to one or the other is partially a subjective decision but will also take into account the specific features of the preferred shares. When used to calculate a company's financial leverage, the debt usually includes only the long-term debt.

Debt/Equity of companies in the Technology sector on NASDAQ compared to Aehr Test Systems

What does Aehr Test Systems do?

headquartered in fremont, california, aehr test systems is a worldwide supplier of systems for burning-in and testing memory and logic integrated circuits and has an installed base of more than 2,500 systems worldwide. aehr test has developed and introduced several innovative products, including the abts, foxtm and max systems and the diepak® carrier. the abts system is aehr test’s newest system for packaged part test during burn-in for both low-power and high-power logic as well as all common types of memory devices. the fox system is a full wafer contact test and burn-in system. the max system can effectively burn-in and functionally test complex devices, such as digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. the diepak carrier is a reusable, temporary package that enables ic manufacturers to perform cost-effective final test and burn-in of bare die.

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